Chief executive officer Kwak Noh-Jung said the Nvidia supplier and the world’s second-largest memory chipmaker will begin sending samples of the latest version of HBM chips, called 12-layer HBM3E, in May and begin mass producing them in the third-quarter.
Kwak said its HBM products this year had already sold out, while 2025 HBM volumes were almost sold out amid a rapid expansion of AI technology into a wider range of on-device applications such as smartphones, PCs, and automobiles.
Last month, SK Hynix announced new investment plans – a $3.87 billion plan to build an advanced chip packaging plant in the U.S. state of Indiana with an HBM chip line and a 5.3 trillion won ($3.85 billion) investment in a new DRAM chip factory at home with a focus on HBMs.
